Gas chromatography chip and multi-layered gas chromatography chip assembly thereof

A gas chromatography chip comprising:

• a substrate comprising an upper substrate and a lower substrate;
• a gas supply connecting part formed on one plane of one surface of the substrate or on one plane of an opposite surface of the substrate;
• a gas discharge connecting part formed another plane of the one surface of the substrate or on another plane of the opposite surface of the substrate;
• a micro channel continuously extending from the gas supply connecting part to the gas discharge connecting part to form a micro channel part and having a circular cross-section;
• at least two position alignment markers formed on the one surface or the opposite surface of the substrate;
• a heat transfer part and a temperature control unit for controlling a temperature of the substrate;
• a stationary phase as a sealing member for sealing a bonding surface of the substrate when an entire surface of the substrate on which the micro channel is formed is coated and the upper substrate and the lower substrate are bonded to each other;
• wherein the gas supply connecting part has a tapered shape a width thereof is large at a gas supply hole and becomes narrower toward the micro channel,
• the micro channel is formed through multi-etching in which etching is performed three times or more and is formed on one side surface of the upper substrate, one side surface of the lower substrate, or side surfaces of the upper substrate and the lower substrate facing each other,
• the gas supply connecting part and the gas discharge connecting part of the substrate are formed through an EDM (electrical discharge machining) scheme or sandblasting, and
• the temperature control unit performs control of a temperature of the substrate and applies a thermal pressure to the substrate to prevent loss of a gas in the micro channel formed in the substrate, and
• the stationary phase is a PDMS, and
• wherein the PDMS is applied as the stationary phase and for the purpose of bonding and sealing the upper substrate and the lower substrate.