Compressive sensing for metrology
AssigneeKLA-Tencor Corporation
InventorsStilian Ivanov Pandev, Alexander Kuznetsov, Gregory R. Brady, Andrei V. Shchegrov, Noam Sapiens, John J. Hench
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AssigneeKLA-Tencor Corporation
InventorsStilian Ivanov Pandev, Alexander Kuznetsov, Gregory R. Brady, Andrei V. Shchegrov, Noam Sapiens, John J. Hench
Estimating the term…
Disclosed are apparatus and methods for determining a structure or process parameter value of a target of interest on a semiconductor wafer. A plurality of collection patterns are defined for a spatial light beam controller positioned at a pupil image plane of a metrology tool. For each collection pattern, a signal is collected from a sensor of the metrology tool, and each collected signal represents a combination of a plurality of signals that the spatial light beam controller samples, using each collection pattern, from a pupil image of the target of interest. The collection patterns are selected so that the pupil image is reconstructable based on the collection patterns and their corresponding collection signals. The collected signal for each of the collection patterns is analyzed to determine a structure or process parameter value for the target of interest.
A method of determining a structure or process parameter value of a target of interest on a semiconductor wafer, the method comprising:
A semiconductor metrology system, comprising:
A method of determining a structure or process parameter value of a target of interest on a semiconductor water, the method comprising:
Dependencies are inferred from the claim text.