Back to results
US 9,518,887 B2Granted
Flexible interconnect structure for a sensor assembly
AssigneeKulite Semiconductor Products, Inc.
InventorsLouis DeRosa, Robert Gardner
Life of this patent
Estimating the term…
Abstract
This disclosure provides example methods, devices, and systems for a flexible interconnect structure for a sensor assembly. In one configuration, a flexible interconnect structure may couple a first portion of a differential sensor structure to a second portion of the differential sensor structure. Further, the flexible interconnect structure may couple the differential sensor structure to an external component such as a circuit board, used to receive measurement information from the differential sensor.
Claims18
A sensor assembly, comprising:
- a housing;
- a first sensor structure disposed on a first portion of the housing, the first sensor structure configured to measure a first pressure;
- a second sensor structure disposed on a second portion of the housing, the second sensor structure configured to measure a second pressure;
- a main connector disposed on a third portion of the housing, the main connector configured to interface with an external component;
- a flexible interconnect structure connected to the first sensor structure, the second sensor structure, and the main connector, the flexible interconnect structure comprising:
- a first rigid section coupled to and in electrical communication with the first sensor structure;
- a first flexible section having a frontend in electrical communication with the first rigid section;
- a second rigid section coupled to and in electrical communication with the second sensor structure, the second rigid section having a frontend in electrical communication with a backend of the first flexible section;
- a second flexible section having a frontend in electrical communication with a backend of the second rigid section;
- and
- a third rigid section coupled to and in electrical communication with the main connector, the third rigid section having a frontend in electrical communication with a backend of the second flexible section, wherein the third rigid section is configured to receive signals from the first sensor structure and the second sensor structure;
- wherein each of the first rigid section, the second rigid section, and the third rigid section is an independently rigid printed circuit board (PCB) integrated with the flexible interconnect structure and wherein each of the first sensor structure and the second sensor structure comprises:
- a header;
- a sensor element;
- and
- one or more header pins coupled to the header and electrically coupled to the sensor element.
13 more elements
A sensor assembly, comprising:
- a housing;
- a first sensor structure disposed on a first portion of the housing, the first sensor structure configured to measure a first pressure;
- a second sensor structure disposed on a second portion of the housing, the second sensor structure configured to measure a second pressure;
- and
- a flexible interconnect structure connected to the first sensor structure and the second sensor structure, the flexible interconnect structure configured to interface with an external component, the flexible interconnect structure comprising:
- a first rigid section coupled to and in electrical communication with the first sensor structure;
- a first flexible section having a frontend in electrical communication with the first rigid section;
- a second rigid section coupled to and in electrical communication with the second sensor structure, the second rigid section having a frontend in electrical communication with a backend of the first flexible section;
- a second flexible section having a frontend in electrical communication with a backend of the second rigid section;
- and
- a third rigid section having a frontend in electrical communication with a backend of the second flexible section, wherein the third rigid section is configured to receive signals from the first sensor structure and the second sensor structure, and wherein the third rigid section is configured for coupling with the external component;
- wherein each of the first rigid section, the second rigid section, and the third rigid section is an independently rigid printed circuit board (PCB) integrated with the flexible interconnect structure and wherein each of the first sensor structure and the second sensor structure comprises:
- a header;
- a sensor element;
- and
- one or more header pins coupled to the header and electrically coupled to the sensor element.
13 more elements
Dependencies are inferred from the claim text.