Epitaxial growth method
AssigneeSumco Corporation
InventorsMasayuki Ishibashi, John F. Krueger, Takayuki Dohi, Daizo Horie, Takashi Fujikawa
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AssigneeSumco Corporation
InventorsMasayuki Ishibashi, John F. Krueger, Takayuki Dohi, Daizo Horie, Takashi Fujikawa
Estimating the term…
A method for growing an epitaxial film on a surface of a semiconductor wafer by mounting the wafer within a susceptor pocket and supplying source gas and carrier gas to the upper surface side of the susceptor and supplying carrier gas to the lower surface side of the susceptor. The susceptor includes a substantially circular bottom wall and a sidewall encompassing the bottom wall to form a pocket for mounting the wafer, wherein a plurality of circular through-holes are formed in the bottom wall in an outer peripheral region a distance of up to about ½ the radius toward the center of the bottom wall. The total opening surface area of the through-holes is 0.05 to 55% of the surface area of the bottom wall, the opening surface area of each through-hole is 0.2 to 3.2 mm2 and the density of the through-holes is 0.25 to 25 per cm2.
An epitaxial growth method for growing an epitaxial film on a surface of a semiconductor wafer by mounting the semiconductor wafer within a susceptor pocket of a susceptor, the susceptor comprising a substantially circular bottom wall having an upper surface and a lower surface that forms a back surface of the susceptor and a sidewall encompassing the bottom wall to form a pocket for mounting the semiconductor wafer, wherein a plurality of through-holes that pass through said bottom wall and form circular or polygonal openings in the upper surface and the lower surface of said bottom wall, each of the through-holes having a linear axis extending from the upper surface to the lower surface of said bottom wall, are provided in the bottom wall within a region of up to approximately half the radius of the bottom wall from the outer periphery to the center, in a radial direction, with the through-holes being included within at least the region of the bottom wall on which the semiconductor wafer is mounted;
An epitaxial growth method for growing an epitaxial film on a surface of a semiconductor wafer by mounting the semiconductor wafer within a pocket of a susceptor, the susceptor comprising a substantially circular bottom wall having an upper surface and a lower surface that forms a back surface of the susceptor and a sidewall encompassing the bottom wall to form a pocket for mounting the semiconductor wafer, wherein a plurality of through-holes that pass through said bottom wall and form circular or polygonal openings in the upper surface and the lower surface of said bottom wall, each of the through-holes having a linear axis extending from the upper surface to the lower surface of said bottom wall, are provided in the bottom wall within a region of up to approximately half the radius of the bottom wall from the outer periphery to the center, in a radial direction, with the through-holes being included within at least the region of the bottom wall on which the semiconductor wafer is mounted;
Dependencies are inferred from the claim text.