Method for forming an electrostatic chuck using film printing technology

A method for fabricating an electrostatic chuck comprising:

• forming vias in a ceramic plate;
• printing a metal paste in the vias and curing the ceramic plate;
• printing the metal paste on a front surface of the ceramic plate and curing the ceramic plate;
• printing the metal paste on a bottom surface of the ceramic plate and curing the ceramic plate to form one or more contact pads on the bottom surface of the ceramic plate;
• and
• printing a dielectric film on the front surface of the ceramic plate and curing the ceramic plate, wherein the printing the dielectric film comprises printing dielectric bumps on the front surface of the ceramic plate.

A method for fabricating an electrostatic chuck comprising:

• forming vias in a ceramic plate;
• printing a silver paste in the vias and curing the ceramic plate;
• printing the silver paste on a front surface of the ceramic plate and curing the ceramic plate;
• printing the silver paste on a bottom surface of the ceramic plate and curing the ceramic plate to form one or more contact pads and one or more heating elements on a bottom surface of the ceramic plate;
• printing a dielectric film on the front surface of the ceramic plate and curing the ceramic plate;
• bonding the ceramic plate to a backing plate by using a reactive nano metal bond, wherein the metal bond is a resistive element sandwiched within a low temperature melting material on both sides, wherein the low temperature material melts at about 100 degrees Celsius or less.

An electrostatic chuck comprising:

• a ceramic plate comprising:
• vias formed therethrough, wherein the vias are filled with silver;
• one or more silver layers on a front surface of the ceramic plate forming one or more electrodes;
• and
• one or more silver layers on a back surface of the ceramic plate forming one or more contact pads, wherein the one or more contact pads are coupled to the electrodes by the vias;
• and
• a metal backing plate bonded to the ceramic plate with a reactive nano metal bond, without a thermal annealing process.