US 9,517,963 B2Granted

Method for rapid laser drilling of holes in glass and products made therefrom

AssigneeCorning Incorporated

InventorsSasha Marjanovic, Garrett Andrew Piech, Shyamala Shanmugam, Carlos Alberto Pons Siepermann, Sergio Tsuda, Zsigmond Varga, Robert Stephen Wagner

Life of this patent

Estimating the term…

patentgrep

Loading patent…

Abstract

Forming holes in a material includes focusing a pulsed laser beam into a laser beam focal line oriented along the beam propagation direction and directed into the material, the laser beam focal line generating an induced absorption within the material, the induced absorption producing a defect line along the laser beam focal line within the material, and translating the material and the laser beam relative to each other, thereby forming a plurality of defect lines in the material, and etching the material in an acid solution to produce holes greater than 1 micron in diameter by enlarging the defect lines in the material. A glass article includes a stack of glass substrates with formed holes of 1-100 micron diameter extending through the stack.

Claims16

Dependent claims

An article comprising:

a substrate having a plurality of etched through-holes continuously extending from a first surface of the substrate to a second surface of the substrate, wherein:
the substrate is transparent to at least one wavelength in a range from 390 nm to 700 nm;
the plurality of etched through-holes have a diameter of 20 μm or less;
a spacing between adjacent etched through-holes of 10 μm or greater;
the plurality of etched through-holes comprise an opening in the first surface, an opening in the second surface, and a waist located between the opening in the first surface and the opening in the second surface;
a diameter of the waist is at least 50% of the diameter of the opening in the first surface or the opening in the second surface;
and
a difference between a diameter of the opening in the first surface and a diameter of the opening in the second surface is 3 μm or less.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/535,754Filed 7 Nov 2014 · us provisional application
Priority: 17 Dec 2013
Published: US 2015/0166395 A118 Jun 2015
Granted: 13 Dec 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

B23K 26/0613
By a combination of beams: having a common axis
B23K 26/04
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam: automatically…
B23K 26/0617
Having a common axis: and with spots spaced along the common axis
B23K 26/0624
By shaping pulses: using ultrashort pulses, i.e. pulses of 1 ns or less

Family

Application61/917,179Us provisional application · filed 17 Dec 2013
Application62/023,429Us provisional application · filed 11 Jul 2014
Application62/073,191Us provisional application · filed 31 Oct 2014
US 2015/0166395 A1Pre-grant publication · published 18 Jun 2015
US 9,517,963 B2This patent

From the US filing history. Foreign family members aren’t listed.