US 9,517,962 B2Granted

Plate-shaped object processing method

AssigneeDisco Corporation

InventorsNoboru Takeda, Hiroshi Morikazu, Xiaoming Qiu, Fumiteru Tashino, Ken Togashi

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Abstract

A plate-shaped object processing method forms a through hole of a desired shape in a plate-shaped object. The method includes a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object. The beam is applied along the contour of the through hole to be formed by a pulsed laser beam irradiation unit including a condenser applying the laser beams. A through hole is formed by breaking the laser-processed contour of the through hole and forming the through hole by positioning an ultrasonic transducer of an ultrasonic wave applying unit in correspondence with the contour of the through hole to be formed, and applying an ultrasonic wave.

Claims4

Dependent claims

A plate-shaped object processing method forming a through hole of a desired shape in a plate-shaped object, the plate-shaped object processing method comprising:

a through hole contour forming step of performing laser processing within the plate-shaped object along a contour of the through hole to be formed, by positioning, within the plate-shaped object, a focal point of a pulsed laser beam of a wavelength capable of passing through the plate-shaped object and applying the pulsed laser beam along the contour of the through hole to be formed by pulsed laser beam irradiation means including a condenser applying the laser beam;
and
a through hole forming step of breaking the laser-processed contour of the through hole to be formed and forming the through hole in the plate-shaped object by positioning an ultrasonic transducer of ultrasonic wave applying means in correspondence with the contour of the through hole to be formed in the plate-shaped object resulting from the through hole contour forming step and applying an ultrasonic wave.

Dependencies are inferred from the claim text.

Facts

Application: 14/660,146Filed 17 Mar 2015
Priority: JP 2014-05340917 Mar 2014
Published: US 2015/0259235 A117 Sep 2015
Granted: 13 Dec 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification17 codes

C03B 33/0222
Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor: scoring using a focussed radiation beam, e.g. laser
B23K 20/10
Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating: making use of…
B23K 26/0006
Working by laser beam, e.g. welding, cutting or boring: taking account of the properties of the material involved
B23K 26/03
Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam: observing, e.g.…

Family

US 2015/0259235 A1Pre-grant publication · published 17 Sep 2015
US 9,517,962 B2This patent

From the US filing history. Foreign family members aren’t listed.

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