Method of fabricating electromechanical microchips with a burst ultrafast laser pulses
AssigneeRofin-Sinar Technologies Inc.
InventorS. Abbas Hosseini
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Abstract
A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of: machining, using photoacoustic compression, full or partial voids in at least one of the plurality of substrates. The plurality of transparent substrates are stacked and arranged in a specific order. The transparent substrates are affixed and sealed together. The chip may be sealed by laser welding or adhesive.
Claims11
A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:
- machining full or partial voids on said first transparent substrate using photoacoustic compression;
- and,
- affixing said first transparent substrate and said second transparent substrate together.
A method for making an electromechanical chip using a first transparent substrate and a second transparent substrate, comprising the steps of:
- machining full or partial voids in said first transparent substrate using photoacoustic compression;
- machining full or partial voids in said second transparent substrate using photoacoustic compression;
- placing said first and second transparent substrates in engagement with one another such that said full or partial voids of said first transparent substrate communicate with said full or partial voids of said second transparent substrate.
A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of:
- machining, using photoacoustic compression, full or partial voids in at least one of said plurality of substrates;
- stacking said plurality of transparent substrates in a specific order;
- affixing said substrates together.
A method for making an electromechanical chip using a plurality of transparent substrates, comprising the steps of:
- machining, using photoacoustic compression, full or partial voids in at least two of said plurality of substrates;
- stacking said plurality of machined transparent substrates in a specific order and formatting said electromechanical chip as a device selected from the group of electrodes, wires, electrical and mechanical conduits, electrical and mechanical sensors, transistors, TTL circuits, logic circuits, capacitors, diodes, Zener diodes, Schottky diodes, linear and switching power supplies, power supply circuits including bridge circuits, chemical and biological analytic circuits, microfluidic channels, microfluidic controls and other microelectronics;
- and,
- affixing said substrates together.
Dependencies are inferred from the claim text.