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US 9,517,626 B2Granted
Printed circuit board fluid ejection apparatus
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Michael W. Cumbie
Life of this patent
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Abstract
In an example, a fluid ejection apparatus includes a printhead die embedded in a printed circuit board. Fluid may flow to the printhead die through a plunge-cut fluid feed slot in the printed circuit board and into the printhead die.
Claims20
A fluid ejection apparatus comprising:
- a printhead die having a first surface including at least one drop ejector, wherein the printhead die comprises a number of ports extending partially into the printhead die from the first surface without extending through to a second surface of the printhead die opposite the first surface;
- a printed circuit board including the printhead die embedded in the printed circuit board such that the at least one drop ejector is exposed at a first surface of the printed circuit board, and a conductor coupled to a conductor on the printhead die;
- and
- a plunge-cut fluid feed slot through which fluid may flow to the printhead die, the plunge-cut fluid feed slot extending through a second surface, opposite the first surface, of the printed circuit board and into the second surface, opposite the first surface, of the printhead die exposing the number of ports formed therein.
1 more element
A fluid ejection apparatus comprising:
- a plurality of printhead dies comprising a number of fluid flow passages extending partially into a first surface of the printhead die without extending through to a second surface of the printhead die opposite the first surface;
- a printed circuit board in which the plurality of printhead dies are mounted, the printed circuit board including conductors coupled to conductors of the printhead dies and a plurality of plunge-cut fluid feed slots through which fluid may flow to the printhead dies via the number of fluid flow passages when the plunge-cut is formed, each of the plunge-cut fluid feed slots extending into the printed circuit board and the printhead dies;
- and
- wherein the number of fluid flow passages fluidically couple each of the plurality of printhead dies with at least one of the plurality of plunge-cut fluid feed slots.
1 more element
A method for making a fluid ejection apparatus, comprising:
- mounting a printhead die having a first surface including at least one drop ejector in an opening of a first printed circuit board layer set;
- applying a barrier over the opening with the first surface of the printhead die against the barrier;
- flowing adhesive around the printhead die to adhere the printhead die in the opening;
- and
- removing the barrier covering the opening;
- coupling a second printed circuit board layer set to the first printed circuit board layer set to cover a second surface, opposite the first surface, of the printhead die;
- after coupling the second printed circuit board layer set to the first printed circuit board layer set, plunge-cutting a fluid feed slot through the second printed circuit board layer set and into the second surface of the printhead die such that fluid may flow through the fluid feed slot to the printhead die;
- and
- coupling a conductor of the first printed circuit board layer set to a conductor of the printhead die;
- wherein plunge-cutting the fluid feed slot through the second printed circuit board layer set and into the second surface of the printhead die opens a port defined in the printhead die to allow fluid to pass through the fluid feed slot and into the printhead die.
7 more elements
Dependencies are inferred from the claim text.