Wiring mounting structure and method of manufacturing the same, and liquid ejecting head and liquid ejecting apparatus

A wiring mounting structure comprising:

• a first base that has a first main surface, a second main surface that is an undersurface opposite to the first main surface, and an inclined surface that is formed between the first main surface and the second main surface to have an angle as a reference angle with the second main surface, which is less than 90 degrees;
• a second base that has a third main surface which is joined to the second main surface of the first base;
• an adhesive which is disposed between the second main surface of the first base and the third main surface of the second base from an end portion of the inclined surface of the first base to an exposed region on the third main surface of the second base and by which the first base and the second base are joined;
• and
• a connection wiring that is provided to be continuous from the inclined surface to a front surface of the adhesive to the third main surface of the second base, wherein the connection wiring directly contacts the inclined surface, the front surface, and the third main surface,
• wherein the front surface of the adhesive is provided to be continuous to the inclined surface and thus an angle formed between the front surface of the adhesive in a portion in which the adhesive is provided to be continuous to the inclined surface and the third main surface on which the adhesive is provided is less than the reference angle, and
• wherein the adhesive provided to be continuous to the inclined surface is also provided on the inclined surface.