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US 9,517,520 B2Granted
Apparatus of mounting and removing component, method of mounting component and method of removing component
AssigneeFujitsu Limited
InventorsYasuyuki Kusakabe, Tooru Harada
Life of this patent
Estimating the term…
Abstract
An apparatus for mounting and removing a component includes: a light source configured to radiate light toward a component supported by solder; a light sensor configured to sense displacement of the component; and a member mounted on the component, the member including a hole in a portion to be irradiated with the light of the light source.
Claims20
An apparatus of mounting and removing a component comprising:
- a light source configured to radiate light toward a component supported by solder;
- a light sensor configured to sense displacement of the component;
- and
- a member mounted on the component on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface and being irradiated with the light of the light source, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component,
- wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess.
2 more elements
A method of mounting a component comprising:
- mounting a member on a component to be supported by solder on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component;
- irradiating the recess with a light;
- sensing melting of the solder with a light sensor configured to sense displacement of the component;
- and
- stopping irradiation of the member with the light for which the melting of the solder is sensed,
- wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess.
3 more elements
A method of removing a component comprising:
- mounting a member on a component supported by solder on a first surface of the member, the member including a recess having a bottom in the member on a second surface of the member opposite to the first surface, a part of the first surface which is located at a position corresponding to the bottom of the recess, being in contact with the component;
- irradiating the recess with a light;
- sensing melting of the solder with a light sensor that senses displacement of the component;
- and
- removing the component for which the melting of the solder is sensed,
- wherein an opening of the recess faces the light source such that the light enters from the opening and irradiates the bottom of the recess.
3 more elements
Dependencies are inferred from the claim text.