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US 9,439,307 B2Granted
Laminated punched sheet metal electronic enclosure/shield with integrated gaskets
AssigneeTektronix, Inc.
InventorsM. David Swafford, Marcus K. Da Silva, Steve U. Reinhold
Life of this patent
Estimating the term…
Abstract
An assembly suitable for housing electronic components can include a top shield and a bottom shield, the bottom shield having a conductive outer cover, a wall section, and a laminating portion between the conductive outer cover and the wall section. The laminating portion may include laminating material. A printed circuit board (PCB) may be positioned between the top shield and the bottom shield.
Claims9
An assembly suitable for housing electronic components, the assembly comprising:
- a top shield;
- a bottom shield coupled with the top shield, the bottom shield including:
- a conductive outer cover;
- a wall section;
- and
- a laminating portion between the conductive outer cover and the wall section, the laminating portion comprising laminating material that substantially covers a surface of the conductive outer cover;
- a printed circuit board (PCB) positioned between the top shield and the bottom shield;
- and
- at least one mechanical hardware component configured to provide proper spacing between the wall section of the bottom shield and the PCB.
6 more elements
Dependencies are inferred from the claim text.