Multilayered chip electronic component and board for mounting the same

A board for mounting a multilayered chip electronic component, the board comprising:

• a multilayered chip electronic component comprising:
• a ceramic body including internal electrodes and dielectric layers;
• external electrodes covering both end surfaces of the ceramic body in a length direction;
• first plating layers forming the external electrodes and formed on outer surfaces of the ceramic body;
• non-conductive layers formed on outer side surfaces of the first plating layers;
• and
• second plating layers formed on regions of outer surfaces of the first plating layers except for the non-conductive layers;
• electrode pads connected to the second plating layers by soldering fillets;
• and
• a printed circuit board having the electrode pads formed thereon,
• wherein the soldering fillets are formed to respective one ends of the non-conductive layers adjacent to the printed circuit board.

A multilayered chip electronic component comprising:

• first plating layers formed on side surfaces and an upper surface of a ceramic body having a hexahedral shape;
• non-conductive layers formed on the side surfaces of the ceramic body;
• and
• second plating layers coated on regions of outer surfaces of the first plating layers except for the non-conductive layers,
• wherein the second plating layers are only formed in band portions of external electrodes formed on the outer side surfaces, an upper surface, and a lower surface of the ceramic body except for the end surfaces of the ceramic body.