Mounting method of electronic component and electronic component mount body

An electronic component mount body in which the electronic component is mounted on the mount board by performing a mounting method comprising the steps of:

• providing at least two of component terminals for the electronic component;
• providing at least two of board terminals for the mount board;
• and
• providing an inclined portion on a surface of the board terminal, the inclined portion being wider as closer to a base end side toward a peripheral edge thereof, wherein
• in a case where a position of at least one of the component terminals is offset along the inclined portion in relation to a position of the corresponding board terminal, and a position of at least one of the component terminals among the other component terminals is offset along the inclined portion in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal, the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal, and wherein
• at least one of the component terminals is offset in relation to the corresponding board terminal to be bonded thereto, and
• at least one of the component terminals among the other component terminals is offset in the opposite side to the direction of the offset in relation to the corresponding board terminal to be bonded thereto.

A manufacturing method of an electronic component mount body in which an electronic component is mounted on a mount board by flip-chip bonding, including mounting the electronic component on the mount board by performing a mounting method comprising:

• providing at least two of component terminals for the electronic component;
• providing at least two of board terminals for the mount board;
• and
• providing an inclined portion on a surface of the board terminal, the inclined portion being wider as closer to a base end side toward a peripheral edge thereof, wherein
• in a case where a position of at least one of the component terminals is offset along the inclined portion in relation to a position of the corresponding board terminal, and a position of at least one of the component terminals among the other component terminals is offset along the inclined portion in the opposite side to the direction of the offset in relation to a position of the corresponding board terminal, the component terminal makes contact with the inclined portion of the board terminal to bond the component terminal and the board terminal.