Low-profile outdoor lighting module with light emitting diodes

A method comprising:

• mounting a light emitting diode (LED) die on a substrate, wherein the substrate has a top surface and a bottom surface, wherein a landing pad is disposed on the top surface of the substrate;
• attaching the landing pad to a contact pad disposed on an underside of a lip of a printed circuit board, wherein the printed circuit board has a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein the lip is disposed around a periphery of the lower indentation, and wherein the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar after the landing pad is attached;
• placing a highly reflective sheet in the upper indentation;
• placing a lens in the upper indentation over the highly reflective sheet, wherein the lens has a curved optical portion and a flat lip;
• and
• attaching an inside surface of a molded-plastic cover both to the upper surface of the printed circuit board and to the flat lip of the lens using a double-sided adhesive sheet.

A device comprising:

• a light emitting diode (LED) die;
• a substrate with a top surface and a bottom surface, wherein the LED die and a landing pad are disposed on the top surface of the substrate;
• a printed circuit board having a lower surface, a lower indentation in the lower surface, an upper surface, and an upper indentation in the upper surface, wherein a contact pad is disposed in the lower indentation, wherein the substrate fits into the lower indentation such that the landing pad contacts the contact pad and such that the lower surface of the printed circuit board and the bottom surface of the substrate are substantially coplanar;
• a lens with a lower surface and a lip, wherein the lower surface of the lens is disposed in the upper indentation;
• and
• means for forming a water-tight seal between the lens and the printed circuit board and for affixing an inside surface of a molded-plastic cover both to the upper surface of the printed circuit board and to the lip of the lens.