Carrier board structure

A carrier board structure providing a coil induction function, comprising:

• a flexible board having a middle region and two side regions bordering the middle region, the middle region thicker than the two side regions and bulgy downwards, an upper surface of the flexible board being smooth, the middle region provided with a middle hole;
• at least one upper magnetic coil embedded in the flexible board, close to the upper surface of the flexible board, and having a spiral shape;
• at least one lower magnetic coil embedded in the flexible board, close to the lower surface of the flexible board, and having a spiral shape;
• a dielectric layer embedded in the flexible board, penetrated through by the middle hole, and separating the upper magnetic coils and the lower magnetic coils;
• at least one connection pad configured in the middle region of the flexible board, close to the middle hole, and penetrating the dielectric layer to connect the upper magnetic coils and the lower magnetic coils;
• and
• at least one gold finger provided on the two side region of the flexible board and electrically connected to the upper magnetic coils,
• wherein the upper magnetic coils and the lower magnetic coils are around the middle hole, the gold finger, the upper magnetic coils, the connection pads and the lower magnetic coils are electrically connected, two fold lines are provided on the lower surfaces of the flexible board and at connections of the middle region and the two side regions, respectively, the fold line has a groove shape depressed upwards so as to help the side region to fold upwards or downwards, and the dielectric layer embedded in the flexible board is broken at the fold lines due to the groove shape such that the dielectric layer in the middle region and the dielectric layer in the side region are not physically connected.