Mounting structure of chip component and electronic module using the same
AssigneeTDK Corporation
InventorsShuichi Takizawa, Kenichi Kawabata
Life of this patent
Estimating the term…
Abstract
An electronic module is provided with a circuit board 2, a chip component 3 surface-mounted on the circuit board 2 and a mold member 4 that seals the chip component 3. The circuit board 2 includes a land 7 and a resist pattern 8A that partially covers the land 7. The chip component 3 has a bottom electrode 6b and a side electrode 6c. The resist pattern 8A has an overlapped portion overlapped with the bottom electrode 6b of the chip component 3 in a planar view. A portion of the mold member 4 is filled at least in a first gap D1 between the resist pattern 8A and the first solder portion 10a.
Claims17
An electronic module comprising:
- a circuit board including a main surface, a land electrode formed on the main surface and a resist pattern having an overlapped portion that covers the land electrode;
- a chip component mounted on the main surface of the circuit board, the chip component including a bottom electrode substantially parallel to the main surface of the circuit board and a side electrode substantially perpendicular to the main surface of the circuit board;
- a solder electrically connecting the bottom and side electrodes of the chip component to the land electrode of the circuit board, the solder including a first solder portion adhered to the side electrode and a second solder portion provided between the bottom electrode and the land electrode;
- and
- a mold member formed on the main surface of the circuit board so as to seal the chip component,
- wherein the first solder portion is overlapped with the overlapped portion of the resist pattern in planar view,
- a first gap is formed between the overlapped portion of the resist pattern and the first solder portion, and
- the first gap is filled with a first portion of the mold member.
A mounting structure of a chip component, comprising:
- a circuit board;
- a plurality of chip components surface-mounted on the circuit board;
- solders that electrically connect the chip components and the circuit board;
- and
- a mold member that seals the chip components, wherein the circuit board includes a wiring layer including a plurality of lands and a solder resist layer that selectively covers the wiring layer,
- wherein the solder resist layer includes resist patterns that partially covers the lands, each of the chip components includes a bottom electrode parallel to a surface of the circuit board and a side electrode perpendicular to the surface of the circuit board,
- each of the solders electrically connects the bottom electrode and the side electrode and an exposed portion of the land, each of the resist patterns has an overlapped portion overlapped with the bottom electrode in a planar view,
- each of the solders has a first solder portion adhered to the side electrode and a second solder portion between the bottom electrode and the exposed portion of the land,
- the first solder portion is overlapped with the overlapped portion of the resist pattern in planar view,
- at least a first gap is formed between the overlapped portion of the resist pattern and the first solder pattern, and
- at least the first gap is filled with the mold member.
Dependencies are inferred from the claim text.