Device mounting board and semiconductor power module

A semiconductor power module comprising:

• a device mounting board which includes a metallic substrate having a first face and a second face opposed to the first face, an insulative film disposed on the first face of the metallic substrate, and a wiring region disposed on the insulative film, wherein the metallic substrate includes a plurality of through-holes each extending from the first face to the second face, and a metallic oxide region existing entirely between each adjacent two of the plurality of through-holes, for electrically isolating the metallic substrate into at least two metallic regions;
• a power device mounted on one of the at least two metallic regions of the metallic substrate, and
• a controller mounted on another of the at least two metallic regions of the metallic substrate.