Ultra low loss dielectric thermosetting resin compositions and high performance laminates manufactured therefrom

A thermosetting resin composition for use in multilayer printed circuit boards for high performance applications defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsiloxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said the setting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.

A thermosetting resin composition for use in prepregs/pre-impregnated composite fibers applications defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at least one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsiloxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said thermosetting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.

A thermosetting resin composition for use in resin coated copper (RCC) applications defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at least one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsiloxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said thermosetting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.

A thermosetting resin composition for use in film adhesives defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at least one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsilaxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said thermosetting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.

A thermosetting resin composition for use in high frequency radomes defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at least one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsiloxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said thermosetting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.

A thermosetting resin composition for use in radio frequency (RF) laminates defined by the formula:

• Tn-[W-(Z)f/(H)1−f-W]n−1-[W-(Z)f/(H)1−f-(OCN)f/(R)1−f]n+2
• wherein “T” is a 1,3,5-substituted-triazine moiety (C3N3);
• “W” is a linking atom between triazine and either component A or component B;
• “Z” is component (A);
• “H” is component (B);
• “OCN” is cyanate ester end group;
• “R” is a reactive end group of component B;
• “n” is an integer greater than or equal to 1;
• and “f” is a weight or mole fraction of component A;
• wherein said thermosetting resin composition is formed by chemical reaction between:
• a. at least one cyanate ester component (A);
• and
• b. at least one reactive intermediate component (B), said component B being capable of copolymerization with said component (A), said component (B) is a thermoplastic selected from the group consisting of (i) hydroxylated polybutadiene (HPBD) with molecular weights between 100 and 10 000 g/mol, (ii) Hydrogenated hydroxylated polybutadiene (HHPBD), (iii) reactive polydimethylsiloxane (PDMS) with molecular weights between and including 100-20 000 g/mol and at least 2 functional groups per molecule of either hydroxyl or epoxy groups, and (iv) polymethylphenylsiloxane containing between 3-9% OH functional groups;
• whereby said thermosetting resin composition does not undergo phase separation, but instead forms a neat, homogenous resin consisting of a triazine co-polymer that consists of component (A) and component (B) joined through a triazine moiety.