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US 9,439,279 B2Granted
Ceramic circuit board and electronic device
AssigneeNGK Insulators, Ltd.
InventorsMakoto Tani, Yoshihiro Tanaka, Takashi Ebigase
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Abstract
A ceramic circuit board includes a ceramic substrate, and a first metal plate bonded to a front surface of the ceramic substrate. A size of the front surface of the ceramic substrate is smaller than a size of a surface, i.e., a first facing surface, on a side of the first metal plate that faces the ceramic substrate.
Claims4
A ceramic circuit board comprising:
- a ceramic substrate;
- and
- a metal plate bonded to a front surface of the ceramic substrate,
- wherein a size of the front surface of the ceramic substrate is smaller than a size of a surface on a side of the metal plate that faces the ceramic substrate,
- wherein:
- a second metal plate is bonded to a rear surface of the ceramic substrate;
- and
- a size of the rear surface of the ceramic substrate is larger than a size of a surface on a side of the second metal plate that faces the ceramic substrate, and
- wherein the inequality
- t2<ta <t1
- is satisfied, where ta represents a thickness of the ceramic substrate, t1 represents a thickness of the metal plate, and t2 represents a thickness of the second metal plate.
8 more elements
Dependencies are inferred from the claim text.