US 9,438,980 B2 · Headphone ear cup

Abstract

A headphone ear cup for mounting on a surface of a speaker unit of a headphone includes an annular cushion having a sound hole at a center thereof, and a composite cover having a ventilative layer and an air-tight layer. The composite cover wraps around the annular cushion and defines an inner-side portion, an outer-side portion and an ear-abutting portion. The ventilative and air-tight layers are respectively formed by the outer-side portion and a composite of the inner-side and ear-abutting portions or by a composite of the outer-side and ear-abutting portions and the inner-side portion. Therefore, the ventilative layer and the annular cushion form a good heat dissipation path to have excellent air-permeable property, and air-tight layer provides an improved acoustic field effect.

Claims14

Dependent claims

A headphone ear cup, comprising:

an annular cushion provided at a center thereof with a sound hole;
and
a composite cover having a ventilative layer and an air-tight layer, and wrapping around the annular cushion to define an inner-side portion surrounding the sound hole, an outer-side portion opposite to the inner-side portion spacedly and remote from the sound hole, and an ear-abutting portion connected between the outer-side portion and the inner-side portion;
wherein the ventilative layer has an air permeability higher than that of the air-tight layer, the ventilative layer is formed by the outer-side portion and the ear-abutting portion, and the air-tight layer is formed by the inner-side portion;
wherein the ventilative layer and the air-tight layer are made from different material.

2 more elements

Dependencies are inferred from the claim text.

Headphone ear cup

Life of this patent

Headphone ear cup

Life of this patent

Abstract

Claims14