Component package including matching circuit and matching method thereof

A matching method of a component package including

• a central component,
• external terminals provided in both sides of the component package,
• a matching unit including
• a substrate disposed inside the component package between the central component and one of the external terminals,
• a transmission line formed on the substrate, a first side of the transmission line being connected to said one of the external terminals of the component package,
• bonding wires electrically connecting the transmission line and the central component such that first ends of the bonding wires are connected to the central component and second ends of the bonding wires are connected to the transmission line,
• a capacitor unit including a plurality of capacitors arranged in a matrix format within the substrate, the capacitor unit being spaced apart from the transmission line and the bonding wires, and
• a wiring connector separated from the bonding wires and electrically connecting at least one of the capacitors to the transmission line to form a capacitance commonly applied to the bonding wires,
• the method comprising:
• adjusting an inductance of the matching unit by adjusting a length of the bonding wires electrically connecting the transmission line with the central component;
• and
• adjusting the capacitance by increasing or decreasing in a length of the wiring connector connected between the transmission line and the capacitors or between the capacitors in order to adjust the number of the capacitors electrically connected to the transmission line.