Radiation hardened chip level integrated recovery apparatus, methods, and integrated circuits
AssigneeDefense Electronics Corporation
InventorStephan P. Athan
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AssigneeDefense Electronics Corporation
InventorStephan P. Athan
Estimating the term…
Methods, apparatus, and integrated circuits that provide radiation hardening through chip level integrated recovery are provided. The apparatus may include first and second circuits within a partition of an integrated circuit and a state machine configured to monitor current leakage of the first circuit while the first circuit is powered on and to power on the second circuit and power off the first circuit when the monitored first circuit current leakage exceeds a first current leakage threshold. The method may include powering a first circuit of a partition within an integrated circuit, monitoring current leakage of the first circuit while the first circuit is powered on and the second circuit is powered off, and powering off the first circuit and powering on the second circuit when the monitored first circuit current leakage exceeds a first current leakage threshold.
A chip level integrated recovery apparatus comprising:
A radiation hardened chip level integrated recovery method comprising:
Dependencies are inferred from the claim text.