3-D integrated package
AssigneeFinisar Corporation
InventorsYunpeng Song, Yongsheng Liu, Hongyu Deng
Life of this patent
Estimating the term…
Loading patent…
AssigneeFinisar Corporation
InventorsYunpeng Song, Yongsheng Liu, Hongyu Deng
Estimating the term…
In an example embodiment, an electronics package includes one or more insulating layers and an electrically conductive transmission line. The electrically conductive transmission line includes a signal trace disposed substantially parallel to the one or more insulating layers. The electrically conductive transmission line further includes one or more signal vias electrically coupled to the signal trace. The one or more signal vias are configured to pass through at least a portion of the one or more insulating layers. The electronics package further includes one or more electrically conductive ground planes substantially parallel to the one or more insulating layers. The ground planes include one or more signal via ground cuts. The one or more signal via ground cuts provide clearance between the one or more signal vias and the one or more ground planes.
An electronics package comprising:
Multiple component circuitry comprising:
Dependencies are inferred from the claim text.