Compliant high speed interconnects

Abstract

Systems (100) and methods (900) for providing a compliant micro-coaxial interconnect with an integrated circuit or other electronic device. The methods comprise: forming a well (108) in a first substrate (102) having a first Coefficient of Thermal Expansion (“CTE”); forming at least one three-dimensional micro-coaxial interconnect (100) on the first substrate so as to have a cantilevered end portion (110) disposed over the well; and using a first coupler (606) to electrically couple the cantilevered end portion to a second substrate (604) having a second CTE different from the first CTE. The cantilevered end portion has an angled joint (302) so that at least one of a pushing force and a pulling force applied thereby to the first coupler is minimized when mismatching movements of the first and second substrates occur.

Dependencies are inferred from the claim text.