Method for manufacturing electronic device and electronic device manufactured thereby

A method for manufacturing an electronic device, the method comprising:

• fixing a resin substrate to a support substrate with an adhesive layer interposed therebetween to form a laminate structure including the adhesive layer and the resin substrate;
• forming a sealing layer that seals at least a portion of the laminate structure at which the adhesive layer is exposed to form a sealing structure including the sealing layer and the support substrate;
• forming an electronic element above the resin substrate to form the electronic device including the electronic element and the resin substrate;
• exposing the adhesive layer by removing a part of the sealing structure;
• supplying moisture to the adhesive layer;
• and
• peeling the electronic device from the support substrate,
• wherein the adhesive layer contains as a primary component, a material which decreases an adhesion force thereof to the support substrate when absorbing moisture.