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US 9,437,832 B2Granted
Light-emitting device and peeling method
AssigneeSemiconductor Energy Laboratory Co., Ltd.
InventorsTatsuya Sakuishi, Yutaka Uchida, Hiroki Adachi, Saki Eguchi, Junpei Yanaka, Kayo Kumakura, Seiji Yasumoto, Kohei Yokoyama, Akihiro Chida
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Abstract
A flexible device is provided. The hardness of a bonding layer of the flexible device is set to be higher than Shore D of 70, or preferably higher than or equal to Shore D of 80. The coefficient of expansion of a flexible substrate of the flexible device is set to be less than 58 ppm/° C., or preferably less than or equal to 30 ppm/° C.
Claims26
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than Shore D of 70,
- wherein the second bonding layer comprises a second portion whose hardness is higher than Shore D of 70,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than 58 ppm/° C., and
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than 58 ppm/° C.
8 more elements
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than or equal to Shore D of 80,
- wherein the second bonding layer comprises a second portion whose hardness is higher than or equal to Shore D of 80,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than or equal to 27 ppm/° C., and
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than or equal to 27 ppm/° C.
8 more elements
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than Shore D of 70,
- wherein the second bonding layer comprises a second portion whose hardness is higher than Shore D of 70,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than 58 ppm/° C.,
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than 58 ppm/° C., and
- wherein a display portion comprising the light-emitting element is a curved display portion.
9 more elements
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than Shore D of 70,
- wherein the second bonding layer comprises a second portion whose hardness is higher than Shore D of 70,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than 58 ppm/° C.,
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than 58 ppm/° C., and
- wherein the light-emitting device is a foldable light-emitting device.
9 more elements
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than or equal to Shore D of 80,
- wherein the second bonding layer comprises a second portion whose hardness is higher than or equal to Shore D of 80,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than or equal to 27 ppm/° C.,
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than or equal to 27 ppm/° C., and
- wherein a display portion comprising the light-emitting element is a curved display portion.
9 more elements
A light-emitting device comprising:
- a first substrate having flexibility;
- a second substrate having flexibility;
- an element layer between the first substrate and the second substrate;
- an insulating layer between the first substrate and the element layer;
- a first bonding layer between the first substrate and the insulating layer;
- a second bonding layer between the second substrate and the element layer,
- wherein the element layer comprises a light-emitting element,
- wherein the first bonding layer comprises a first portion whose hardness is higher than or equal to Shore D of 80,
- wherein the second bonding layer comprises a second portion whose hardness is higher than or equal to Shore D of 80,
- wherein the first substrate comprises a third portion whose coefficient of expansion is less than or equal to 27 ppm/° C.,
- wherein the second substrate comprises a fourth portion whose coefficient of expansion is less than or equal to 27 ppm/° C., and
- wherein the light-emitting device is a foldable light-emitting device.
9 more elements
Dependencies are inferred from the claim text.