Package support, fabrication method and LED package

A package support comprising:

• metal frames connected together;
• and
• one or more dielectric material disposed in an inner gap of the metal frames;
• wherein the metal frames form a multi-layer structure with each layer having a different pattern;
• and
• areas of the dielectric materials decrease layer by layer from a top to a bottom.

A method comprising:

• providing a metal substrate;
• determining front patterns and back patterns, wherein the back patterns are connected, and wherein the front patterns are smaller than the back patterns;
• etching a front surface and a back surface of the metal substrate respectively to remove regions other than the front patterns and the back patterns;
• forming a gap inside the metal substrate to thereby obtain form metal frames;
• and
• disposing a dielectric material in the gap to thereby form a package support;
• wherein, the metal frames are substantially level with an upper surface of the dielectric material.