Optoelectronic semiconductor component

An optoelectronic semiconductor component comprising:

• at least one optoelectronic semiconductor chip,
• a leadframe having one or a plurality of leadframe parts,
• at least two electrical connection means via which the semiconductor chip is electrically contact-connected to the leadframe, and
• a potting body, which is fitted to the leadframe and mechanically supports the leadframe,
• wherein
• the one or at least one of the leadframe parts is provided with a reflective coating at a top side,
• the semiconductor chip is fitted on the reflective coating at the top side,
• the leadframe comprises at least two contact locations, onto which the connection means are directly fitted,
• the contact locations are formed from a material that is different from the reflective coating, and
• wherein there is no straight, uninterrupted connecting line from a radiation main side of the semiconductor chip, said radiation main side facing away from the top side, to the contact locations such that the contact locations are shaded from direct radiation of the semiconductor chip.