Light emitting device package

A light emitting device package comprising:

• a package body including at least one electrode pad disposed on a surface thereof, the package body including at least one ceramic layer;
• a via hole electrode passing through the package body;
• a heat dissipation portion disposed in the package body;
• an anti-crack portion disposed on the heat dissipation portion and the at least one ceramic layer;
• and
• a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire,
• wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, and a bonding ball is disposed on the stitch,
• wherein the heat dissipation portion is made of a material different from a material of the package body,
• wherein a width of an upper surface of the heat dissipation portion is bigger than a width of a lower surface of the heat dissipation portion,
• wherein the package body includes a first ceramic layer, a second ceramic layer, and a third ceramic layer,
• wherein the second ceramic layer is the anti-crack portion,
• wherein the second ceramic layer is disposed with an opening on the third ceramic layer,
• wherein the light emitting device is disposed on an exposed region of the third ceramic layer,
• wherein the third ceramic layer is disposed between the first ceramic layer and the anti-crack portion,
• wherein a lower surface of the third ceramic layer contacts the heat dissipation portion and the first ceramic layer, and
• wherein an upper surface of the third ceramic layer contacts the anti-crack portion and the light emitting device.