Photoelectric conversion device and method for manufacturing photoelectric conversion device

A photoelectric conversion device comprising:

• a semiconductor substrate;
• a photoelectric conversion portion including first and second semiconductor regions of a first conductivity type disposed in the semiconductor substrate, the first semiconductor region including a first part and a second part different from the first part;
• a transfer portion configured to transfer charges of the first and second semiconductor regions;
• a third semiconductor region of a second conductivity type disposed over both of the first part and the second part of the first semiconductor region;
• and
• a fourth semiconductor region of the second conductivity type,
• wherein the first part, the fourth semiconductor region, and the second part are arranged in this order along a first direction parallel to a surface of the semiconductor substrate,
• wherein the second semiconductor region is disposed under the fourth semiconductor region, the second semiconductor region and the fourth semiconductor region being arranged along a second direction perpendicular to the surface, and
• wherein a length of the first semiconductor region along the first direction is greater than a length of the second semiconductor region along the first direction, and
• a semiconductor region of the second conductivity type is disposed laterally to the second semiconductor region along the first direction and under the first part and the second part of the first semiconductor region along the second direction.

A photoelectric conversion device comprising:

• a semiconductor substrate;
• a photoelectric conversion portion including first and second semiconductor regions of a first conductivity type disposed in the semiconductor substrate;
• a transfer portion configured to transfer charges of the first and second semiconductor regions;
• a third semiconductor region of a second conductivity type disposed over the first semiconductor region;
• and
• a fourth semiconductor region of the second conductivity type,
• wherein the first semiconductor region includes a first part and a second part different from the first part,
• wherein the first part, the second part, and the fourth semiconductor region are disposed at a same depth,
• wherein the first part, the fourth semiconductor region, and the second part are arranged in this order along a first direction parallel to a surface of the semiconductor substrate,
• wherein the second semiconductor region is disposed under the fourth semiconductor region,
• wherein a length of the first semiconductor region along the first direction is greater than a length of the second semiconductor region along the first direction,
• wherein the transfer portion includes a transfer gate electrode, and
• wherein a distance from a center of gravity of an orthogonal projection of the second semiconductor region onto a plane parallel to the surface of the semiconductor substrate to an orthogonal projection of the transfer gate electrode onto the plane is less than a distance from a center of gravity of an orthogonal projection of the first semiconductor region onto the plane to the orthogonal projection of the transfer gate electrode onto the plane.