Method of manufacturing electrical device
AssigneeE. I. Du Pont de Nemours and Company
InventorsHikaru Uno, John Donald Summers, Esther Kim
Life of this patent
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Abstract
A method of manufacturing an electrical device comprising steps of: preparing a substrate; applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof; and heating the applied conductive paste to form an electrode.
Claims19
A method of manufacturing an electrical device, the method comprising:
- preparing a substrate;
- applying a conductive paste onto the substrate, wherein the conductive paste comprises (i) an inorganic powder comprising at least a conductive powder, (ii) an organic polymer, (iii) a solvent and (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), an ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof, wherein the gellant is 0.05 to 15 wt % based on the weight of the conductive paste;
- and
- heating the applied conductive paste to form an electrode.
A conductive paste comprising:
- (i) an inorganic powder comprising at least a conductive powder;
- (ii) an organic polymer;
- (iii) a solvent;
- and
- (iv) a gellant selected from the group consisting of a polyalkyleneoxy terminated polyamide (PAOPA), ester terminated polyamide (ETPA), polyether polyamine (PEPA) and a mixture thereof, wherein the gellant is 0.05 to 15 wt % based on the weight of the conductive paste.
A conductive paste comprising:
- (i) an inorganic powder comprising at least a conductive powder;
- (ii) an organic polymer;
- (iii) a solvent;
- and
- (iv) a gellant having a molecular weight of 1,000 to 100,000.
Dependencies are inferred from the claim text.