Semiconductor element including active region, low resistance layer and vertical drift portion
AssigneeFuji Electric Co., Ltd.
InventorYasuhiko Onishi
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AssigneeFuji Electric Co., Ltd.
InventorYasuhiko Onishi
Estimating the term…
A drain drift portion is a first parallel p-n structure, largely corresponding to a portion directly below a p-type base region forming an active region, formed by first n-type regions and first p-type regions being alternately and repeatedly joined. The periphery of the drain drift portion is an edge termination region formed of a second parallel p-n structure aligned contiguously to the first parallel p-n structure and formed by second n-type regions and second p-type regions being alternately and repeatedly joined. An n-type buffer layer is provided between the first and second parallel p-n structures and an n+ type drain layer. A p+ type drain region is selectively provided inside the n+ type drain layer in the edge termination region, penetrating the n+ type drain layer in the depth direction.
A semiconductor device having an active region, existing on a first main surface side of a substrate, that causes current to flow actively or passively, a first conductivity type low resistance layer that exists in a surface layer on a second main surface side of the substrate, and a vertical drift portion, interposed between the active region and the first conductivity type low resistance layer, through which a drift current flows in a vertical direction in an on-state and which depletes in an off-state, wherein the vertical drift portion forms a first parallel p-n structure formed by first vertical first conductivity type regions oriented in the thickness direction of the substrate and first vertical second conductivity type regions oriented in the thickness direction of the substrate being alternately and repeatedly joined,
Dependencies are inferred from the claim text.