Electronic component manufacturing method and electrode structure

An electronic component manufacturing method, comprising:

• forming a first electrode constituting layer in a recess formed in a workpiece, the recess having an opening diameter of 15 nm or less;
• performing plasma nitridation directly on a surface of the first electrode constituting layer;
• and
• forming a second electrode constituting layer free of Ti directly contacting the first electrode constituting layer, which has been subjected to the plasma nitridation,
• wherein in the forming of the first electrode constituting layer, the first electrode constituting layer is formed by sputtering while a magnetic field is formed on a target surface by a magnet unit having a plurality of magnets disposed at grid points of a polygonal grid arranged in a grid, the magnets being disposed such that adjacent magnets have opposite poles,
• wherein the plasma nitridation is performed while a magnetic field is formed on the target surface by the magnet unit, and
• wherein in the forming of the second electrode constituting layer, the second electrode constituting layer having a flat surface is formed by sputtering while a magnetic field is formed on the target surface by the magnet unit.