Semi-conductor device with epitaxial source/drain facetting provided at the gate edge

A semiconductor structure comprising:

• a substrate;
• an isolation layer on the substrate;
• an active layer on the isolation layer;
• a first gate structure and a second gate structure on the active layer;
• a raised epitaxial layer on the active layer between the first gate structure and the second gate structure;
• a trench extending vertically through the raised epitaxial layer and the active layer such that the trench has a bottom comprising a portion of the isolation layer and such that the raised epitaxial layer comprises:
• a first raised epitaxial region located on the active layer between the first gate structure and the trench, the first raised epitaxial region having a first facet shaped edge adjacent to the first gate structure and a first vertical shaped edge opposite the first facet shaped edge;
• and,
• a second raised epitaxial region located on the active layer between the trench and the second gate structure, the second raised epitaxial region having a second facet shaped edge adjacent to the second gate structure and a second vertical shaped edge opposite the second facet shaped edge;
• silicide layers on the raised epitaxial layer, the silicide layers comprising:
• a first silicide layer on the first raised epitaxial region;
• and
• a second silicide layer on the second raised epitaxial region;
• and,
• trench sidewall spacers within the trench and comprising:
• a first trench sidewall spacer on the portion of the isolation layer at the bottom of the trench and positioned laterally immediately adjacent to a first sidewall of the trench so as to be positioned laterally immediately adjacent to the active layer, the first vertical shaped edge of the first raised epitaxial region, and the first silicide layer;
• and,
• a second trench sidewall spacer on the portion of the isolation layer at the bottom of the trench and positioned laterally immediately a second sidewall of the trench opposite the first sidewall so as to be positioned laterally immediately adjacent to the active layer, the second vertical shaped edge of the second raised epitaxial region and the second silicide layer,
• the trench sidewall spacers comprising remaining vertical portions of a deposited and etched dielectric layer.

A semiconductor structure comprising:

• an oxide layer;
• an active layer on the oxide layer;
• a first gate structure and a second gate structure on the active layer;
• a raised epitaxial layer on the active layer between the first gate structure and the second gate structure;
• a trench extending vertically through the raised epitaxial layer and the active layer to the oxide layer such that a bottom of the trench comprises a portion of the oxide layer and such that the raised epitaxial layer comprises:
• a first raised epitaxial region located on the active layer between the first gate structure and the trench, the first raised epitaxial region having a first facet shaped edge adjacent to the first gate structure and a first vertical shaped edge opposite the first facet shaped edge;
• and,
• a second raised epitaxial region located on the active layer between the trench and the second gate structure, the second raised epitaxial region having a second facet shaped edge adjacent to the second gate structure and a second vertical shaped edge opposite the second facet shaped edge;
• first gate sidewall spacers on opposing sidewalls of both the first gate structure and the second gate structure;
• second gate sidewall spacers on the first gate sidewall spacers, the second gate sidewall spacers filling spaces between the first gate sidewall spacers and the first facet shaped edge of the first raised epitaxial region adjacent to the first gate structure and the second facet shaped edge of the second raised epitaxial region adjacent to the second gate structure;
• silicide layers on the raised epitaxial layer, the silicide layers comprising:
• a first silicide layer on a first top surface only of the first raised epitaxial region;
• and,
• a second silicide layer on a second top surface only of the second raised epitaxial region;
• and,
• trench sidewall spacers within the trench and comprising:
• a first trench sidewall spacer on the portion of the oxide layer at the bottom of the trench and positioned laterally immediately adjacent to a first sidewall of the trench so as to be positioned laterally immediately adjacent to the active layer, the first vertical shaped edge of the first raised epitaxial region, and the first silicide layer;
• and,
• a second trench sidewall spacer on the portion of the oxide layer at the bottom of the trench and positioned laterally immediately adjacent to a second sidewall of the trench opposite the first sidewall so as to be positioned laterally immediately adjacent to the active layer, the second vertical shaped edge of the second raised epitaxial region and the second silicide layer,
• the second gate sidewall spacers and the trench sidewall spacers comprising remaining portions of a deposited and etched dielectric layer,
• the first silicide layer extending laterally between the first trench sidewall spacer and a first one of the second gate sidewall spacers such that a first top surface of the first raised epitaxial region is covered by and immediately adjacent to the first silicide layer only, the first one of the second gate sidewall spacers being on a corresponding first one of the first gate sidewall spacers that is adjacent to the first gate structure, and
• the second silicide layer extending laterally between the second trench sidewall spacer and a second one of the second gate sidewall spacers such that a second top surface of the second raised epitaxial region is covered by and immediately adjacent to the second silicide layer only, the second one of the second gate sidewall spacers being on a corresponding second one of the first gate sidewall spacers that is adjacent to the second gate structure.