Three-dimensional memory
AssigneeMacronix International Co., Ltd.
InventorsChih-Wei Lee, Cheng-Hsien Cheng, Shaw-Hung Ku, Wen-Pin Lu
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AssigneeMacronix International Co., Ltd.
InventorsChih-Wei Lee, Cheng-Hsien Cheng, Shaw-Hung Ku, Wen-Pin Lu
Estimating the term…
A three-dimensional memory, which includes memory cell stacked structures. The memory cell stacked structures are stacked by a plurality of memory cell array structures and insulation layers alternatively, and each memory cell array structure includes word lines, active layers, composite layers and sources/drains. The word lines, the active layers and the composite layers extend along a Y direction. The active layers are disposed between the adjacent word lines. The composite layers are disposed between the adjacent word lines and the adjacent active layers, and each composite layer includes a first dielectric layer, a charge storage layer and a second dielectric layer in sequence from the active layers. The sources/drains are disposed in the active layers at equal intervals. A memory cell includes two adjacent sources/drains, the active layer between the two adjacent sources/drains, the first dielectric layer, the charge storage layer and the second dielectric layer on the active layer, and the word lines.
A three-dimensional memory, comprising:
Dependencies are inferred from the claim text.