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US 9,437,584 B2Granted
Electronic apparatus
AssigneeSeiko Epson Corporation
InventorKenya Watanabe
Life of this patent
Estimating the term…
Abstract
An electronic apparatus includes a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked, penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, an MEMS chip mounted on the multilayered structure and provided with an MEMS device, wherein pads connecting to the penetrating electrodes are provided on the MEMS chip.
Claims8
An electronic apparatus comprising:
- a multilayered structure in which a plurality of semiconductor chips provided with semiconductor devices are stacked;
- a plurality of penetrating electrodes penetrating the semiconductor chips and electrically connecting the semiconductor devices of the plurality of semiconductor chips, each of the semiconductor chips including one of the plurality of penetrating electrodes such that a first penetrating electrode in a first semiconductor chip is directly electrically connected to a second penetrating electrode in a second semiconductor chip;
- an MEMS chip mounted on the multilayered structure and provided with an MEMS device,
- wherein a pad connecting to the plurality of penetrating electrodes is provided on the MEMS chip, and
- wherein the plurality of penetrating electrodes connect to a first side of the pad and the MEMS chip is provided on a second side of the pad, opposite the first side, such that the plurality of penetrating electrodes do not extend through the MEMS chip.
2 more elements
Dependencies are inferred from the claim text.