LED module
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
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AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsYoji Urano, Akifumi Nakamura, Hayato Ioka, Ryoji Imai, Jun Goda, Toru Hirano, Masanori Suzuki, Hideaki Hyuga
Estimating the term…
The LED module includes: a light diffusing substrate having light transmissive properties; an LED chip bonded to a first surface of the light diffusing substrate with a transparent first bond in between; a color converter facing the first surface to cover the LED chip; and a mounting substrate. The color converter is made of transparent material containing phosphor which, when excited by light emitted from the LED chip, emits light having a different color from the LED chip. The mounting substrate includes a diffuse reflection layer diffusely reflecting light emitted from the LED chip and light emitted from the phosphor. The diffuse reflection layer is placed facing a second surface of the light diffusing substrate.
An LED module comprising:
Dependencies are inferred from the claim text.