Multiple die face-down stacking for two or more die

A microelectronic assembly, comprising:

• a substrate having first and second opposed surfaces each extending in first and second transverse directions, the substrate having first and second dielectric elements spaced apart from one another in at least one of the first or second transverse directions;
• an opening defined by an open area between adjacent opposed edges of the first and second dielectric elements, the adjacent opposed edges each having a first dimension extending in the first direction, the opening having a second dimension in the second direction shorter than the first dimension;
• a microelectronic element having a front surface, a rear surface opposite from the front surface, and bond pads at the front surface, one of the front or rear surfaces facing toward the first surface;
• and
• a plurality of terminals exposed at the second surface and electrically connected with the bond pads of the microelectronic element, the terminals configured for connecting the microelectronic assembly to at least one component external to the assembly.