Package on package structure with pillar bump pins and related method thereof
AssigneeMediatek Inc.
InventorsWen-Sung Hsu, Shih-Chin Lin
Life of this patent
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Abstract
A package on package (POP) structure includes at least a first package and a second package. The first package has a plurality of pillar bump pins. The second package has a plurality of pads connected to the pillar bump pins, respectively. A method of forming a package on package (POP) structure includes at least the following steps: providing a first package with a plurality of pillar bump pins; providing a second package with a plurality of pads; and forming the POP structure by connecting the pillar bump pins to the pads.
Claims10
A package on package (POP) structure, comprising:
- a first package, having a plurality of pillar bump pins;
- and
- a second package, having a plurality of pads connected to the pillar bump pins, respectively, having at least one die inside, wherein a middle part of one of the pillar bump pins is pillar and a top part of the pillar bump pin is an elongated bump, and the top part of the one of the pillar bump pins is formed before the first package is connected to the second package;
- and the plurality of pillar bump pins are not overlaid with the at least one die of the second package.
A method of forming a package on package (POP) structure, comprising:
- providing a first package with a plurality of pillar bump pins, wherein a middle part of one of the pillar bump pins is pillar and a top part of the pillar bump pin is an elongated bump;
- providing a second package with a plurality of pads, wherein the second package has at least one die inside;
- and
- forming the POP structure by connecting the pillar bump pins to the pads;
- wherein the top part of the one of the pillar bump pins is formed before the first package is connected to the second package;
- and the plurality of pillar bump pins are not overlaid with the at least one die of the second package.
Dependencies are inferred from the claim text.