High-frequency module

A high-frequency module comprising:

• a laminate including a plurality of base materials, the plurality of base materials being stacked on each other in a lamination direction;
• a plurality of bottom surface electrodes configured to provide grounding provided on one principal surface of the laminate in the lamination direction;
• a high-frequency circuit electrically connected to at least any of the bottom surface electrodes, a portion of the high-frequency circuit being provided inside the laminate;
• and
• a plurality of internal electrodes configured to provide grounding, each of the plurality of internal electrodes being provided on a respective one of the plurality of base materials of the laminate;
• wherein
• the plurality of internal electrodes are electrically connected to respective ones of the plurality of bottom surface electrodes;
• each of the plurality of internal electrodes has a line shape including ends and extends outside of the high-frequency circuit along an outer periphery of the laminate;
• each of the plurality of internal electrodes extends along less than an entirety of the outer periphery of the laminate when seen in the lamination direction such that a portion of each of the respective ones of the plurality of base materials is in direct contact with a portion of another one of the plurality of base materials along the outer periphery of the laminate;
• and
• the plurality of internal electrodes in combination extend along the entirety of the outer periphery of the laminate when seen in the lamination direction.