High frequency integrated circuit and packaging for same
AssigneeAnalog Devices, Inc.
InventorsAndrew Pye, Rodrigo Carrillo-Ramirez
Life of this patent
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Abstract
An integrated circuit can include a group of bond pads alternating between bond pads configured to provide a return path and bond pads configured to provide a signal bond pad. For example, five bond pads can be arranged in a return-signal-return-signal-return arrangement. The integrated circuit can further be configured to receive or transmit high frequency signals.
Claims27
An integrated circuit package comprising:
- an integrated circuit comprising a circuit and a plurality of bond pads electronically connected to the circuit;
- and
- a package structure comprising a plurality of leads connected to a plurality of the bond pads by a plurality of wire bonds,
- wherein a group of five consecutive bond pads of the plurality of bond pads connected to the leads comprise two signal bond pads configured to transmit the same signal and three return bond pads, one return bond pad being between the two signal bond pads and the other two return bond pads being adjacent the two signal bond pads on opposite sides of the group.
An integrated circuit configured for receiving and/or transmitting a high-frequency signal, the integrated circuit comprising:
- a group of five consecutive bond pads configured to communicate the high-frequency signals to or from the integrated circuit, three of the bond pads being return path bond pads and two of the bond pads being signal bond pads configured to carry the same signal,
- wherein the three return path bond pads and the two signal bond pads are arranged in a sequentially alternating configuration.
A method of assembling a printed circuit board comprising:
- mounting an integrated circuit to a package structure, the integrated circuit comprising a plurality of bond pads electronically connected to a radio frequency circuit, the plurality of bond pads comprising a group of five consecutive bond pads, three of the consecutive bond pads being return bond pads and two of the consecutive bond pads being signal bond pads configured to transmit the same signal, the five consecutive return bond pads and the signal bond pads being arranged in a sequentially alternating configuration;
- and
- wirebonding each of the group of five consecutive bond pads to a corresponding one of consecutively positioned leads of the package structure.
An integrated circuit package comprising:
- an integrated circuit comprising a circuit and a plurality of bond pads electronically connected to the circuit;
- and
- a package structure comprising a plurality of leads connected to a plurality of the bond pads by a plurality of wire bonds,
- wherein a group of three consecutive bond pads of the plurality of bond pads connected to the leads comprise one signal bond pad and two return bond pads, the signal bond pad being between the two return bond pads, the two return bond pads configured to provide a return path only for signals carried on the signal bond pad,
- wherein the circuit is configured to transmit or receive signals with a frequency of greater than or equal to about 1 GHz through the signal bond pad and impedance for the transition between the bond pads and the leads is less than 10% of system impedance for the circuit.
Dependencies are inferred from the claim text.