Semiconductor package having magnetic substance and related equipment
AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Wook Ji, Hyoung-Yol Mun, Yeong-Lyeol Park, In-Kyum Lee
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AssigneeSamsung Electronics Co., Ltd.
InventorsSang-Wook Ji, Hyoung-Yol Mun, Yeong-Lyeol Park, In-Kyum Lee
Estimating the term…
Provided is a semiconductor device. A semiconductor chip is disposed on a substrate. A first magnetic substance, a second magnetic substance and a third magnetic substance which are spaced apart from one another are formed on the semiconductor chip. The first magnetic substance and the second magnetic substance can be adjacent an edge of the semiconductor chip. The third magnetic substance can be adjacent a center of the semiconductor chip. The third magnetic substance is between the first magnetic substance and the second magnetic substance.
A semiconductor package comprising:
A semiconductor package comprising:
A semiconductor package comprising:
Dependencies are inferred from the claim text.