Concentric bump design for the alignment in die stacking
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJung Wei Cheng, Tsung-Ding Wang, Chien-Hsun Lee
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Abstract
An integrated circuit structure includes an alignment bump and an active electrical connector. The alignment bump includes a first non-solder metallic bump. The first non-solder metallic bump forms a ring encircling an opening therein. The active electrical connector includes a second non-solder metallic bump. A surface of the first non-solder metallic bump and a surface of the second non-solder metallic bump are substantially coplanar with each other.
Claims20
An integrated circuit structure comprising:
- an alignment bump comprising:
- a first non-solder metallic bump forming a ring encircling an opening therein, wherein the alignment bump is a dummy bump;
- a dielectric layer having a top surface in contact with a bottom surface of the first non-solder metallic bump, wherein the dielectric layer extends directly underlying the opening;
- and
- an active electrical connector comprising:
- a second non-solder metallic bump, wherein a top surface of the first non-solder metallic bump and a top surface of the second non-solder metallic bump are substantially coplanar with each other, wherein the active electrical connector is electrically coupled to an active device.
An integrated circuit structure comprising:
- a first package component comprising:
- an alignment bump at a surface of the first package component, wherein the alignment bump is electrically floating, wherein the alignment bump forms a ring encircling an opening therein, and wherein the alignment bump comprises:
- a first non-solder metallic bump;
- a first electrical connector, wherein the first electrical connector has a solid shape with no opening therein, and wherein the first electrical connector comprises:
- a second non-solder metallic bump;
- a first solder region contacting the first non-solder metallic bump;
- a second solder region contacting the second non-solder metallic bump;
- and
- a second package component comprising:
- a second electrical connector bonded to the first electrical connector through the first solder region;
- and
- a metal bump bonded to the alignment bump through the second solder region.
An integrated circuit structure comprising:
- a device die comprising:
- a first non-solder metallic bump forming a full ring, with an opening encircled by the full ring;
- and
- a first solder region over the first non-solder metallic bump, wherein the first solder region contacts a top surface of the first non-solder metallic bump, and portions of the top surface of the first non-solder metallic bump in contact with the first solder region forms a full ring, and wherein the first solder region comprises:
- a ring portion, with a void extending from a top surface of the first non-solder metallic bump up into the first solder region;
- and
- a top portion over the void, wherein the top portion is connected to the ring portion.
Dependencies are inferred from the claim text.