US 9,437,549 B2Granted

Method for manufacturing ceramic substrate

AssigneeViking Tech Corporation

InventorsChien-Hung Ho, Chen-Shen Kuo, Chun-Chu Wu

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Abstract

A method for manufacturing a ceramic substrate is characterized in using a preformed trench, a patterned protective layer and a sand blasting process to manufacture a cavity in a ceramic substrate and control the cavity size and shape of the ceramic substrate. The ceramic substrate is collocated with a base substrate to form a package substrate for packaging a semiconductor chip. The manufacturing method set forth above can lower the manufacturing cost and raise the accuracy of the size and shape of the cavity of the ceramic substrate. The abovementioned method can reduce the fabrication cost and increase the precision of the shape and size of a ceramic substrate.

Claims6

Dependent claims

A method for manufacturing a ceramic substrate having a cavity, comprising steps:

providing a ceramic substrate having a first surface and a second surface;
fabricating a preformed trench in said first surface of said ceramic substrate;
fabricating a patterned protective layer on said second surface of said ceramic substrate;
and
sand-blasting said second surface of said ceramic substrate to form a cavity, wherein said cavity penetrates said first surface and said second surface of said ceramic substrate and has a vertical portion and a gradually-varying portion, wherein said vertical portion is near said first surface and has an inner diameter identical to a first diameter of said cavity on said first surface, and wherein said gradually-varying portion is near said second surface and has an inner diameter gradually increasing from said first diameter to a second diameter of said cavity on said second surface.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/808,656Filed 24 Jul 2015
Priority: TW 103125263 A24 Jul 2014
Published: US 2016/0049372 A118 Feb 2016
Granted: 6 Sep 2016
Term ends: Not estimatedThe source records don’t support an estimate.

Classification21 codes

H10W 70/614
For connecting multiple chips together: the multiple chips being integrally enclosed
B23K 26/364
Laser etching: for making a groove or trench, e.g. for scribing a break initiation groove
B23K 26/38
Removing material: by boring or cutting
B23K 26/402
Taking account of the properties of the material involved: involving non-metallic material, e.g. isolators

Family

US 2016/0049372 A1Pre-grant publication · published 18 Feb 2016
US 9,437,549 B2This patent

From the US filing history. Foreign family members aren’t listed.

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