Method for manufacturing electrical connections in a semiconductor device and the semiconductor device

A semiconductor device including a semiconductor element received in an annular resin casing which has an opening portion and which is molded integrally with lead terminals by insert molding, the semiconductor device comprising:

• the lead terminals each of which is provided with a bonding portion and a terminal portion;
• the resin casing which is formed by the insert molding, while clamp portions having clamp protrusions formed in the bonding portions of the lead terminals are put between molds opposed to each other in a state in which the clamp portions are protruded into the opening portion;
• an insulating substrate which has a wiring pattern mounted with the semiconductor element disposed in the opening portion;
• and
• bonding wires which make electric connection between the semiconductor element and one of the bonding portions of the lead terminals and between the wiring pattern on the insulating substrate and another of the bonding portions of the lead terminals;
• wherein:
• the clamp portions are provided with notch portions.