Chip on film package including distributed via plugs

A chip on film (COF) package, comprising:

• a film substrate;
• a semiconductor chip on a first surface of the film substrate;
• first leads on the first surface of the film substrate, the first leads extending from the semiconductor chip to a first length to have first ends;
• second leads on the first surface of the film substrate, the second leads extending from the semiconductor chip to a second length larger than the first length to have first ends;
• first via plugs penetrating the film substrate and connected to the first ends of the first leads, and second via plugs penetrating the film substrate and connected to the first ends of the second leads;
• first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs;
• and
• second connection leads disposed on the first surface of the film substrate, the second connection leads being electrically connected to the first ends of the second leads.

A film of a chip on film (COF) package, the film comprising:

• a film substrate;
• first leads on a first surface of the film substrate, the first leads extending from a semiconductor chip and having a first length;
• second leads on the first surface of the film substrate, the second leads extending from the semiconductor chip having a second length longer than the first length;
• first via plugs penetrating the film substrate and connected to first ends of the first leads;
• second via plugs penetrating the film substrate and connected to the second leads;
• first connection leads on a second surface of the film substrate facing the first surface, the first connection leads having first ends connected to the first via plugs and second ends that form first pads on the second surface, the first connection leads extending from the first via plugs in a direction toward the semiconductor chip;
• and
• second connection leads on the second surface of the film substrate, the second connection leads having first ends electrically connected to the second via plugs and the second connection leads extending in an opposite direction from the semiconductor chip.