Semiconductor device and manufacturing method thereof

A semiconductor device, comprising:

• a first titanium layer that is formed to cover at least part of a semiconductor layer and comprises titanium;
• an aluminum layer that is formed on the first titanium layer on a side opposite of the semiconductor layer and essentially consists of aluminum;
• a titanium nitride layer that is formed on the aluminum layer on a side opposite of the first titanium layer and comprises titanium nitride;
• an electrode layer that is formed on the titanium nitride layer on a side opposite of the aluminum layer and comprises silver;
• and
• a second titanium layer that is formed either between the aluminum layer and the titanium nitride layer or between the titanium nitride layer and the electrode layer and comprises titanium, wherein
• the titanium nitride layer has a thickness of greater than 50 nm,
• after a first surface of the semiconductor layer is subject to a process treatment, the first titanium layer is formed on an entirety of a surface of the semiconductor layer opposite to the first surface, and
• wherein each layer of the semiconductor device covers and directly contacts an entirety of the surface of an adjacent layer.

A semiconductor device, comprising:

• a first titanium layer that is formed to cover a semiconductor layer and comprises titanium;
• an aluminum layer that is formed on the first titanium layer on a side opposite of the semiconductor layer and essentially consists of aluminum;
• a titanium nitride layer that is formed on the aluminum layer on a side opposite of the first titanium layer and comprises titanium nitride;
• an electrode layer that is formed on the titanium nitride layer on a side opposite of the aluminum layer and comprises silver;
• a second titanium layer that is formed between the aluminum layer and the titanium nitride layer and comprises titanium;
• and
• a third titanium layer that is formed between the titanium nitride layer and the electrode layer and comprises titanium, wherein
• the titanium nitride layer has a thickness of greater than 50 nm,
• after a first surface of the semiconductor layer is subject to a process treatment, the first titanium layer is formed on an entirety of a surface of the semiconductor layer opposite to the first surface, and
• wherein each layer of the semiconductor device covers and directly contacts an entirety of the surface of an adjacent layer.

A manufacturing method of a semiconductor device, comprising:

• forming a first titanium layer that comprises titanium and covers an entirety of a semiconductor layer;
• forming an aluminum layer that essentially consists of aluminum on the first titanium layer on a side opposite of the semiconductor layer;
• forming a titanium nitride layer that comprises titanium nitride on the aluminum layer on a side opposite of the first titanium layer;
• and
• forming an electrode layer that comprises silver on the titanium nitride layer on a side opposite of the aluminum layer, wherein
• the forming the titanium nitride layer forms the titanium nitride layer to have a thickness equal to or greater than 100 nm,
• the forming the first titanium layer to the forming the electrode layer are all performed in a non-oxygen atmosphere,
• the forming a first titanium layer, the forming an aluminum layer, the forming a titanium nitride layer, and the forming an electrode layer are continuously performed while they are kept in a chamber,
• further comprising process treating a first surface of the semiconductor layer,
• wherein after a first surface of the semiconductor layer is subject to the process treating, the first titanium layer is formed on a surface of the semiconductor layer opposite to the first surface such that the first titanium layer of the semiconductor device covers and contacts an entirety of the surface of the semiconductor layer opposite to the first surface, and
• wherein each of the layers is formed such that each of the layers covers and directly contacts an entirety of the surface of a previously formed layer.

A manufacturing method of a semiconductor device, comprising:

• forming a first titanium layer that comprises titanium and covers an entirety of a surface of a semiconductor layer;
• forming an aluminum layer that essentially consists of aluminum on the first titanium layer on a side opposite of the semiconductor layer;
• forming a titanium nitride layer that comprises titanium nitride on the aluminum layer on a side opposite of the first titanium layer;
• forming an electrode layer that comprises silver on the titanium nitride layer on a side opposite of the aluminum layer;
• and
• forming a second titanium layer that comprises titanium either between the forming the aluminum layer and the forming the titanium nitride layer or between the forming the titanium nitride layer and the forming the electrode layer, wherein
• the forming the titanium nitride layer forms the titanium nitride layer to have a thickness of greater than 50 nm,
• the forming the first titanium layer to the forming the electrode layer are all performed in a non-oxygen atmosphere, and
• the forming a first titanium layer, the forming an aluminum layer, the forming a titanium nitride layer, and the forming an electrode layer are continuously performed while they are kept in a chamber,
• further comprising process treating a first surface of the semiconductor layer,
• wherein after a first surface of the semiconductor layer is subject to the process treating, the first titanium layer is formed on a surface of the semiconductor layer opposite to the first surface such that the first titanium layer of the semiconductor device covers and contacts an entirety of the surface of the semiconductor layer opposite to the first surface, and
• wherein each of the layers is formed such that each of the layers covers and directly contacts an entirety of the surface of a previously formed layer.

A manufacturing method of a semiconductor device, comprising:

• forming a first titanium layer that comprises titanium and covers an entirety of a surface of a semiconductor layer;
• forming an aluminum layer that essentially consists of aluminum on the first titanium layer on a side opposite of the semiconductor layer;
• forming a titanium nitride layer that comprises titanium nitride on the aluminum layer on a side opposite of the first titanium layer;
• forming an electrode layer that comprises silver on the titanium nitride layer on a side opposite of the aluminum layer;
• forming a second titanium layer that comprises titanium between the forming the aluminum layer and the forming the titanium nitride layer;
• and
• forming a third titanium layer that comprises titanium between the forming the titanium nitride layer and the forming the electrode layer, wherein
• the forming the titanium nitride layer forms the titanium nitride layer to have a thickness of greater than 50 nm,
• the forming the first titanium layer to the forming the electrode layer are all performed in a non-oxygen atmosphere, and
• the forming a first titanium layer, the forming an aluminum layer, the forming a titanium nitride layer, and the forming an electrode layer are continuously performed while they are kept in a chamber,
• further comprising process treating a first surface of the semiconductor layer,
• wherein after a first surface of the semiconductor layer is subject to the process treating, the first titanium layer is formed on a surface of the semiconductor layer opposite to the first surface such that the first titanium layer of the semiconductor device covers and contacts an entirety of the surface of the semiconductor layer opposite to the first surface, and
• wherein each of the layers is formed such that each of the layers covers and directly contacts an entirety of the surface of a previously formed layer.