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US 9,437,519 B2Granted
Tim strain mitigation in electronic modules
AssigneeInternational Business Machines Corporation
InventorsGerard McVicker, Sri M. Sri-Jayantha
Life of this patent
Estimating the term…
Abstract
A lid including a lid body, and a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion.
Claims20
A heat spreading lid comprising:
- a lid body;
- and
- a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion,
- wherein a thermal interface material is disposed between the die and the wing portion such that the wing portion moves with the thermal interface material independently from the lid body.
1 more element
A device comprising:
- a die;
- a thermal interface material disposed on the die;
- a heat spreading lid disposed on the thermal interface material opposite the die, the lid comprising a lid body;
- and
- a wing portion, the wing portion being disposed on a die side of the lid body such that an edge of the wing portion is flexible independent from a portion of the lid body adjacent to the edge of the wing portion,
- wherein the thermal interface material is disposed between the die and the wing portion such that the wing portion moves with the thermal interface material independently from the lid body.
3 more elements
A device comprising:
- a die;
- a thermal interface material disposed on the die;
- and
- a heat spreading lid disposed on the thermal interface material opposite the die, the lid including a trench extending along a portion of the lid corresponding to a corner of the die,
- wherein the trench moves with the thermal interface material independently from the lid body.
2 more elements
Dependencies are inferred from the claim text.