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US 9,437,518 B2Granted
Semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsJaebum Byun, Heeyoub Kang, Dongok Kwak, Junghoon Kim, Joonyoung Oh, Won-Hwa Lee, Jae-Woo Jeong, Jinyoung Choi
Life of this patent
Estimating the term…
Abstract
A semiconductor module may include a heat-transferring part connecting at least one of a control device, a buffer semiconductor device, and a memory device to a connector. The heat-transferring part may be configured to have a thermal conductivity higher than the substrate. Accordingly, during the operation of the semiconductor module, the connector can have a temperature lower than the devices.
Claims19
A semiconductor module comprising:
- a substrate;
- a control device mounted on a bottom surface of the substrate;
- a buffer semiconductor device mounted on the bottom surface of the substrate;
- a memory device mounted on the bottom surface of the substrate;
- a heat-transferring part contacting the control device;
- an electrical connector that is configured to connect the semiconductor module to an external device and that is provided on a side surface of the substrate and contacting the heat-transferring part;
- a passive device pad disposed on a top surface of the substrate;
- a passive device disposed on the passive device pad;
- a thermoelectric pad disposed on the passive device;
- and
- a case contacting the thermoelectric pad and surrounding the substrate, the passive device pad, the passive device, and the thermoelectric pad.
8 more elements
A semiconductor module comprising:
- a substrate;
- a control device mounted on a bottom surface of the substrate;
- a buffer semiconductor device mounted on the bottom surface of the substrate;
- a first memory device mounted on the bottom surface of the substrate;
- a second memory device mounted on a top surface of the substrate;
- an upper heat-transferring part provided on the top surface of the substrate and contacting the second memory device;
- an electrical connector that is configured to connect the semiconductor module to an external device and that is provided on a first side surface of the substrate and contacting the upper heat-transferring part;
- a passive device pad disposed on the top surface of the substrate;
- a passive device disposed on the passive device pad;
- a thermoelectric pad disposed on the passive device;
- and
- a case contacting the thermoelectric pad and surrounding the substrate, the passive device pad, the passive device, and the thermoelectric pad.
9 more elements
A semiconductor module comprising:
- a substrate;
- an electrical connector that is configured to connect the semiconductor module to an external device and that is provided on a side surface of the substrate;
- at least one of a control device, a buffer semiconductor device, a first memory device and a second memory device, mounted on a surface of the substrate;
- a first heat-transferring part contacting the connector and the at least one of the control device, the buffer semiconductor device, the first memory device and the second memory device, wherein the first heat-transferring part is configured to transfer heat generated in the at least one of the control device, the buffer semiconductor device, the first memory device and the second memory device to the connector;
- a passive device pad disposed on a top surface of the substrate;
- a passive device disposed on the passive device pad;
- a thermoelectric pad disposed on the passive device;
- and
- a case contacting the thermoelectric pad and surrounding the substrate, the passive device pad, the passive device, and the thermoelectric pad.
6 more elements
Dependencies are inferred from the claim text.